TLE4291 데이터 시트보기 (PDF) - Infineon Technologies
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TLE4291 Datasheet PDF : 28 Pages
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TLE4291
General Product Characteristics
4.2
Functional Range
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min.
Max.
4.2.1 Input Voltage Range for Normal VI
Operation
VQ + Vdr
42
V
1)
4.2.2 Extended Input Voltage Range
VI
3.3
42
V
2)
4.2.3 Junction Temperature
Tj
-40
150
°C –
4.2.4 Output Capacitor Requirements CQ
22
–
µF
3)
4.2.5
ESRCQ –
3
4)
1) For specification of the output voltage VQ and the drop out voltage Vdr, see Chapter 5 Voltage Regulator.
2) The output voltage will follow the input voltage, but is outside the specified range.
For details see Chapter 5 Voltage Regulator.
3) The minimum output capacitance is applicable for a worst case capacitance tolerance of 30%
4) Relevant ESR value at f = 10 kHz
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
4.3.1
4.3.2
4.3.3
Junction to Case1)
Junction to Ambient1)
RthJC
–
RthJA
–
–
7
–
43
–
120 –
K/W
K/W
K/W
–
2)
Footprint only3)
4.3.4
–
59
–
K/W 300 mm2 heatsink
area on PCB3)
4.3.5
–
49
–
K/W 600 mm2 heatsink
area on PCB3)
1) Not subject to production test, specified by design.
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
3) Specified RthJA value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).
Data Sheet
8
Rev. 1.1, 2012-12-03
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