TPS852 데이터 시트보기 (PDF) - Toshiba

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TPS852

TOSHIBA Photo-IC Silicon Epitaxial Planar

Toshiba 

(2) Recommended soldering pattern

0.3

1.0

0.5 0.5

Unit: mm

TPS852

(3) Cleaning conditions

When cleaning is required after soldering

Chemicals: AK225 alcohol

Temperature and time: 50°C × 30 s or 30°C × 3 mins

Ultrasonic cleaning: 300 W or less

Packing Specification

(1) Packing quantity

Reel (minimum packing quantity)

Carton

3,000 devices

5 reels (15,000 devices)

(2) Packing format

An aluminum envelope containing silica gel and reels is deaerated and sealed.

Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.

• Carton specification

Label

Carton dimensions

(W) 81 mm × (L) 280 mm × (H) 280 mm

5

2007-10-01

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