TS600-200F 데이터 시트보기 (PDF) - Tyco Electronics

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TS600-200F

PolySwitch Resettable Devices Telecommunications & Networking Devices

Tyco Electronics 

Agency Recognition for Telecommunications and Networking Devices

UL

File # E74889

CSA

File #78165C

TÜV

Per IEC60730-1

Certificate # for individual products available upon request.

Recommended Pad Layouts for Surface-mount Telecommunications and Networking

Table T7

Devices in millimeters (inches) Nominal

Device

TS250 (All)

TSV250 (All)

TSL250 (All)

TS600 (All)

TSM600 (All)

A

4.60

(0.180)

2.29

(0.090)

3.60

(0.140)

10.42

(0.410)

5.20

(0.205)

B

1.80

(0.070)

2.41

(0.095)

1.80

(0.070)

3.30

(0.130)

17.80

(0.701)

C

6.10

(0.240)

6.35

(0.250)

5.50

(0.220)

3.35

(0.132)

5.54

(0.218)

D

—

—

3.43

(0.135)

—

—

—

—

6.75

(0.266)

E

—

—

—

—

—

—

—

—

2.08

(0.082)

F

—

—

—

—

—

—

—

—

3.12

(0.123)

G

—

—

—

—

—

—

—

—

8.39

(0.331)

Figure

T18

T19

T18

T18

T20

Figure T18

Figure T19

Figure T20

A

B

C

B

A

B

C

D

A

B

B

A

C

D

EG

F

10

202

Solder Reflow and Rework Recommendations for Telecommunications Surface-mount Devices

Profile Feature

Pb-Free Assembly

Average ramp up rate (TsMAX to Tp)

Preheat

3°C/second max.

• Temperature min. (TsMIN)

• Temperature max. (TsMAX)

• Time (tsMIN to tsMAX)

Time maintained above:

150°C

200°C

60-180 seconds

• Temperature (TL)

• Time (tL)

Peak/Classification temperature (Tp)

217°C

60-150 seconds

260°C

Time within 5°C of actual peak temperature

Time (tp)

20-40 seconds

Ramp down rate

6°C/second max.

Time 25°C to peak temperature

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package

body surface.

Figure T21

Tp

T

L Ts

MAX

Ts

MIN

25

Reflow Profile

tp

Ramp up

tL

Critical Zone

T to Tp

L

ts

Preheat

Ramp down

t 25˚C to Peak

Time

Solder Reflow

• Recommended reflow method: IR, vapor phase oven, hot air oven.

• Surface-mount devices are not designed to be wave soldered to the bottom side of the board.

• Recommended maximum paste thickness of 0.25mm (0.010 in).

• Devices can be cleaned using standard industry methods and solvents.

Rework

• If a device is removed from the board, it should be discarded and replaced with a new device.

RoHS compliant, ELV compliant

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