UPD160062 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD160062

384-/360-OUTPUT TFT-LCD SOURCE DRIVER

NEC => Renesas Technology 

µ PD160062

11. RECOMMENDED MOUNTING CONDITIONS

The following conditions must be met for soldering conditions of the µ PD160062.

For more details, refer to the Semiconductor Device Mount Manual

(http://www.necel.com/pkg/en/mount/index.html).

Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under

different conditions.

µ PD160062N-×××: TCP (TAB package)

Mounting Condition

Mounting Method

Thermocompression Soldering

ACF

(Adhesive Conductive

Film)

Condition

Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100g (per

solder)

Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm2, time 3 to 5 seconds.

Real bonding 165 to 180°C, pressure 25 to 45 kg/cm2, time 30 to 40 seconds.

(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo

Bakelite, Ltd.)

Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF

manufacturing company. Be sure to avoid using two or more packaging methods at a time.

Data Sheet S16449EJ1V0DS

17

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