UPD16750 데이터 시트보기 (PDF) - NEC => Renesas Technology
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UPD16750 Datasheet PDF : 24 Pages
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µPD16750
10. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the µ PD16750.
For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
µ PD16750N-xxx : TCP (TAB Package)
Mounting Condition
Mounting Method
Thermocompression
Soldering
ACF
(Adhesive
Conductive Film)
Condition
Heating tool 300 to 350°C, heating for 2 to 3 seconds : pressure 100g
(per solder)
Temporary bonding 70 to 100°C : pressure 3 to 8 kg/cm2: time 3 to 5
sec. Real bonding 165 to 180°C: pressure 25 to 45 kg/cm2: time 30 to
40 sec. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite,Ltd).
Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more mounting methods at a time.
Data Sheet S13719EJ4V0DS00
21
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