UPD3739 데이터 시트보기 (PDF) - NEC => Renesas Technology
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UPD3739 Datasheet PDF : 24 Pages
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µPD3739
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Type of Through-hole Device
µPD3739D: CCD linear image sensor 22-pin ceramic DIP (CERDIP) (400 mil)
Process
Partial heating method
Conditions
Pin temperature: 260 ˚C or below, Heat time: 10 seconds or less (per pin).
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