UPD77110 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD77110

16-BIT FIXED-POINT DIGITAL SIGNAL PROCESSORS

NEC => Renesas Technology 

µPD77110, 77111, 77112

12. RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the following conditions.

For details of the recommended soldering conditions, refer to information document “SEMICONDUCTOR DEVICE

MOUNTING TECHNOLOGY MANUAL” (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Surface mount type

µPD77110GC-9EU: 100-pin plastic TQFP (fine pitch) (14 × 14 mm)

µPD77111GK-xxx-9EU: 80-pin plastic TQFP (fine pitch) (12 × 12 mm)

Process

Infrared ray reflow

VPS

Partial heating method

Conditions

Package peak temperature: 235°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 2 MAX, Number of days: 3Note (after that, prebaking is

necessary for 10 hours)

Package peak temperature: 215°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 2 MAX, Number of days: 3Note (after that, prebaking is

necessary for 10 hours)

Pin temperature: 300°C MAX, Time: 3 seconds MAX (per side of device)

Symbol

IR35-103-2

VP15-103-2

−

µPD77112GC-xxx-9EU: 100-pin plastic TQFP (fine pitch) (14 × 14 mm)

Process

Infrared ray reflow

VPS

Partial heating method

Conditions

Package peak temperature: 235°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 3 MAX, Number of days: 7Note (after that, prebaking is

necessary for 10 hours)

Package peak temperature: 215°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 3 MAX, Number of days: 7Note (after that, prebaking is

necessary for 10 hours)

Pin temperature: 300°C MAX, Time: 3 seconds MAX (per side of device)

Symbol

IR35-107-3

VP15-107-3

−

Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25°C, 65%

RH MAX.

Caution Do not use two or more soldering methods in combination (except partial heating method).

Data Sheet U12801EJ4V0DS00

75

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