VN5050J-E(2006) 데이터 시트보기 (PDF) - STMicroelectronics

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VN5050J-E
(Rev.:2006)

Single channel high side driver for automotive applications

STMicroelectronics 

Package information

5

Package information

VN5050J-E

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second-level interconnect. The category of

Second-Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

5.1

Package Mechanical

Figure 34. PowerSSO-12™ Package Dimensions

D

h x 45˚

C

A2 A

B

ddd C

SEATING

C

PLANE

A1

L

12

7

0.25 mm

GAUGE PLANE

K

EH

1

6

e

X

BOTTOM

Y

VIEW

Table 12. PowerSSO-12™ Mechanical Data

Symbol

A

A1

A2

B

C

D

E

e

H

h

L

k

X

Y

ddd

Min

1.250

0.000

1.100

0.230

0.190

4.800

3.800

5.800

0.250

0.400

0°

1.900

3.600

millimeters

Typ

0.800

Max

1.620

0.100

1.650

0.410

0.250

5.000

4.000

6.200

0.500

1.270

8°

2.500

4.200

0.100

20/23

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