25X10ALAIZ 데이터 시트보기 (PDF) - Winbond

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25X10ALAIZ

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X10AL, W25X20AL, W25X40AL, W25X80AL

12.5 8-Pad WSON 6x5mm Cont’d.

SYMBOL

MILLIMETERS

MIN

TYP.

MAX

SOLDER PATTERN

M

3.40

N

4.30

P

6.00

Q

0.50

R

0.75

INCHES

MIN

TYP.

MAX

0.1338

0.1692

0.2360

0.0196

0.0255

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the

package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid

placement of exposed PCB vias under the pad.

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