25X10AVNIG 데이터 시트보기 (PDF) - Winbond

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25X10AVNIG

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

Winbond 

W25X10A, W25X20A, W25X40A, W25X80A

12.2 8-Pin SOIC 208-mil (Package Code SS)

SYMBOL

A

A1

A2

b

C

D

D1

E

E1

e

H

L

y

θ

MILLIMETERS

MIN

1.75

0.05

1.70

0.35

0.19

5.18

5.13

5.18

5.13

7.70

0.50

-

0°

NOM

1.95

0.15

1.80

0.42

0.20

5.28

5.23

5.28

5.23

1.27 BSC

7.90

0.65

-

-

MAX

2.16

0.25

1.91

0.48

0.25

5.38

5.33

5.38

5.33

8.10

0.80

0.010

8°

MIN

0.069

0.002

0.067

0.014

0.007

0.204

0.202

0.204

0.202

0.303

0.020

-

0°

INCHES

NOM

0.077

0.006

0.071

0.017

0.008

0.208

0.206

0.208

0.206

0.050 BSC

0.311

0.026

-

-

MAX

0.085

0.010

0.075

0.019

0.010

0.212

0.210

0.212

0.210

0.319

0.031

0.004

8°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

- 39 -

Publication Release Date: August 7, 2009

Revision F

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