WED3C7410E16M-400BX 데이터 시트보기 (PDF) - White Electronic Designs Corporation

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WED3C7410E16M-400BX

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-400BX

PACKAGE DESCRIPTION

Package Outline

21x25mm

Interconnects

255 (16x16 ball array less one)

Pitch

1.27mm

Maximum module height

3.90mm

Ball diameter

0.8mm

PACKAGE DIMENSIONS 255 BALL GRID ARRAY

TOP VIEW

BOTTOM VIEW

T

R

P

N

M

L

K

J

H

G

F

E

D

C

B

A

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

NOTES:

1. Dimensions in millimeters and paranthetically in inches.

2. A1 corner is designated with a ball missing the array.

White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520

12

2.20 (0.087)

MAX

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