WED3C7410E16M400BH9C 데이터 시트보기 (PDF) - White Electronic Designs Corporation

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WED3C7410E16M400BH9C

7410E RISC Microprocessor HiTCE™ Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBHX

PRELIMINARY

Item

Color

ELECTRICAL

Dielectric Constant (1MHz/10GHz)

THERMAL

Coefficient of Linear

Thermal Expansion (40~400 degrees C)

Thermal Conductivity (20 degrees C)

MECHANICAL

Flexural Strength

Young’s Modulus of Elasticity

HITCE™ MATERIAL PROPERTIES

CERAMIC

Unit

Al2O3

—

Black

—

9.8

1/degree C

7.1

(x10-6)

w / m•k

14

MPa

400

GPa

310

HiTCE™

Green

5.3/5.2

12.3

2

175

75

ORDERING INFORMATION

WED 3 C 7410E 16M X BH X X

DEVICE GRADE:

M = Military Screened -55°C to +125°C

I = Industrial

-40°C to +85°C

C = Commercial

0°C to +70°C

OPTION:

Blank = 63Pb/37Sn Solder Balls

9 = 90Pb/10Sn Solder Balls

PACKAGE TYPE:

BH = 255 HiTCE™ Ball Grid Array

CORE FREQUENCY (MHz)

400 = 400MHz

450 = 450MHz

L2 CACHE DENSITY:

16Mbits = 256K x 72 SSRAM – 200MHz

PowerPC™ Type:

Type 7410E

C = MULTICHIP PACKAGE

3 = PowerPC™

WHITE ELECTRONIC DESIGNS CORP.

PowerPC™ is a trademark of International Business Machine Corp.

HiTCE™ is a trademark of Kyocera Corp.

July 2004

Rev. 0

14

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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