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XC6221A451NR 데이터 시트보기 (PDF) - TOREX SEMICONDUCTOR

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XC6221A451NR Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
XC6221 Series
PACKAGING INFORMATION (Continued)
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm1600mm2 in one side
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material : Glass EpoxyFR-4
Thickness : 1.6mm
Through-hole : 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125)
Ambient Temperature ()
25
85
Power Dissipation Pd (mW)
600
240
Thermal Resistance (/W
166.67
700
600
500
400
300
200
100
0
25
Pd vs Ta
45
65
85
105
125
Ambient Temperature Ta(℃)
22/28

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