CA1524, CA2524, CA3524
TO SCALE
MECHANISM
39K
430K
PL1
S
PL2
30K
9V
200pF
9V
3
100
MΩ
22MΩ
2
22MΩ
1
8
7
+
CA3160
-
4
10K
100µF
0.1µF
6
68K
6.2K
10K 10µF
2N4037
9V
125µH
470µF
4.7K
200Ω
5V
16 15 14 13 12 11 10 9
910K 910K
2µF
0.47
µF
2µF
2.5V
300K
A
B
C
CA1524
4.7K
12345678
0.01µF
4.7K
6.2K
4.7K
24K
4700pF
FIGURE 26. SCHEMATIC DIAGRAM OF DIGITAL READOUT SCALE
DIMENSIONS AND PAD LAYOUT FOR CA3524RH CHIP
NOTE: Dimensions in parentheses are in millimeters and are de-
rived from the basic inch dimensions as indicated. Grid graduations
are in mils (10-3 inch). The layout represents a chip when it is part of
the wafer. When the wafer is cut into chips, the cleavage angles are
57o instead of 90o with respect to the face of the chip. Therefore, the
isolated chip is actually 7 mils (0.17mm) larger in both dimensions.
15