MP03/300-10 데이터 시트보기 (PDF) - Dynex Semiconductor
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MP03/300-10 Datasheet PDF : 10 Pages
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MP03 XXX 300 Series
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
VGT
IGT
VGD
V
FGM
V
FGN
VRGM
IFGM
P
GM
PG(AV)
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Conditions
Typ. Max. Units
V = 5V, T = 25oC
DRM
case
V = 5V, T = 25oC
DRM
case
At VDRM Tcase = 25oC
Anode positive with respect to cathode
- 3.0 V
- 150 mA
- 0.25 V
-
30
V
Anode negative with respect to cathode - 0.25 V
- 5.0 V
Anode positive with respect to cathode
-
10 A
t
p
=
25µs
- 100 W
-
5
W
ORDERING INSTRUCTIONS
Part number is made up of as follows:
Examples:
MP03 HBT 300 -12
MP
03
HBT
300
12
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at Tcase = 75oC
= VRRM/100
MP03 HBP300 - 16
MP03 HBN300 - 10
MP03 HBT300 - 14
NOTE: Diode ratings and characteristics are comparable with the SCR in types HBP or HBN
Types HBP or HBN can also be supplied with diode polarity reversed, to special order.
MOUNTING RECOMMENDATIONS
s Adequate heatsinking is required to maintain the base temperature
at 75oC if full rated current is to be achieved. Power dissipation may
be calculated by use of VT(TO) and rT information in accordance with
standard formulae. We can provide assistance with calculations or
choice of heatsink if required.
s The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
s Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery of Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build up
and foreign material. Care should be taken to ensure no foreign
particles remain.
s An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
s After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the heatsink.
Using a torque wrench, slowly tighten the recommended fixing
bolts at each end, rotating each in turn no more than 1/4 of a
revolution at a time. Continue until the required torque of 5Nm
(44lb.ins) is reached at both ends.
s It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
3/10
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