USBDFxxW5
3
Package information
Package information
Table 3. SOT323-5L dimensions
A
E
e
b
e
Q1
c
L
HE
A1
A2
Ref.
A
A1
D
A2
b
c
D
E
e
H
Q1
Dimensions
Millimeters
Inches
Min.
Max.
0.8
1.1
0
0.1
0.8
1
0.15
0.3
0.1
0.18
1.8
2.2
1.15
1.35
0.65 Typ.
1.8
2.4
0.1
0.4
Min.
Max.
0.031 0.043
0
0.004
0.031 0.039
0.006 0.012
0.004 0.007
0.071 0.086
0.045 0.053
0.025 Typ.
0.071 0.094
0.004 0.016
Figure 15. Recommended footprint (dimensions in mm)
0.3
1.0
2.9
1.0
0.35
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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