APA3002
Application Information (Cont.)
Thermal Pad Consideration (Cont.)
be as large as practical. If the ambient temperature is
higher than 25°C, a larger copper plane or forced-air cool-
ing will be required to keep the APA3002 junction tem-
perature below the thermal shutdown temperature
(150°C). In higher ambient temperature, higher airflow
rate and/or larger copper area will be required to keep the
IC out of thermal shutdown. See TQFP7x7-48 thermal
pad layout recommendation.
1.7mm
5.5mm
Via diameter
=0.3mm X16
4.5mm
Ground
plane for
Thermal
PAD
Exposed
for thermal
PAD
connected
Figure 5. TQFP7x7-48 thermal pad layout recommenda-
tion
Copyright © ANPEC Electronics Corp.
23
Rev. A.6 - Sep., 2009
www.anpec.com.tw