NXP Semiconductors
BAS16 series
High-speed switching diodes
4.4
4
2.9
1.6
2.1 1.6
1.1 1.2
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint BAS16H (SOD123F)
3.05
2.2
2.1
1.65 0.95
0.5 (2×) 0.6 (2×)
0.5
(2×)
0.6
(2×)
Reflow soldering is the only recommended soldering method.
Fig 20. Reflow soldering footprint BAS16J (SOD323F)
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod323f_fr
BAS16_SER_5
Product data sheet
Rev. 05 — 25 August 2008
© NXP B.V. 2008. All rights reserved.
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