CAV24C02(2015) 데이터 시트보기 (PDF) - ON Semiconductor

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CAV24C02
(Rev.:2015)

2-Kb, 4-Kb, 8-Kb and 16-Kb I2C CMOS Serial EEPROM

ON Semiconductor 

CAV24C02, CAV24C04, CAV24C08, CAV24C16

PACKAGE DIMENSIONS

WLCSP5, 0.86x0.84

CASE 567DD

ISSUE C

PIN A1

REFERENCE

E

ÈÈ

2X

0.10 C

AB

D

2X

0.10 C TOP VIEW

0.10 C

A

A2

5X

0.05 C

NOTE 3

A1

SIDE VIEW

C

SEATING

PLANE

5X b

0.10 M C A B

C

NOTE 4

B

A

e

e1

PIN A1

123

REFERENCE

BOTTOM VIEW

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE

SPHERICAL CROWNS OF THE CONTACT BALLS.

4. COPLANARITY APPLIES TO SPHERICAL CROWNS

OF THE CONTACT BALLS.

5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-

TACT BALL DIAMETER PARALLEL TO DATUM C.

MILLIMETERS

DIM MIN MAX

A 0.29 0.39

A1 0.10 0.14

A2

0.23 REF

b 0.14 0.18

D

0.86 BSC

E

0.84 BSC

e

0.30 BSC

e1

0.52 BSC

RECOMMENDED

SOLDERING FOOTPRINT*

A1

PACKAGE

OUTLINE

0.52

PITCH

5X

0.16

0.30

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

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