HSP50216(2000) 데이터 시트보기 (PDF) - Intersil
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HSP50216 Datasheet PDF : 53 Pages
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HSP50216
Plastic Ball Grid Array Packages (BGA)
o
A1 CORNER
A
D
A1 CORNER I.D.
E
B
TOP VIEW
0.15
0.006
MC
A
B
0.08
0.003
MC
D1
b
14 13 12 11 10 9 8 7 6 5 4 3 2 1
S
A
A1
CORNER
A1
CORNER I.D.
A
B
C
D
E
F
G
H
E1
J
K
L
M
N
P
S
A
e
ALL ROWS AND COLUMNS
BOTTOM VIEW
A1
A2
C
A
bbb C
aaa C
SEATING PLANE
V196.12x12
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.059
-
1.50
-
A1
0.012 0.016 0.31
0.41
-
A2
0.038 0.044 0.96
1.11
-
b
0.016 0.020 0.41
0.51
7
D/E
0.468 0.476 11.90 12.10
-
D1/E1 0.405 0.413 10.30 10.50
-
N
196
196
-
e
0.032 BSC
0.80 BSC
-
MD/ME
14 x 14
14 x 14
3
bbb
0.004
0.10
-
aaa
0.005
0.12
-
NOTES:
Rev. 1 10/99
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
5. Primary datum C and seating plane are defined by the spher-
ical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package center-
lines. When there is an even number of balls in the outer row
the value is “S” = e/2.
SIDE VIEW
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