MD3221N 데이터 시트보기 (PDF) - Shindengen
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MD3221N Datasheet PDF : 26 Pages
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9 Mounting
◆Substrate Mounting Example
TP1
32
IC1
1
C8
TP2 L1
C1−1
C1−2
01N07
1 CN1
C5−1
C5−2
5
MD3221N
R4−2
R6 JP1 R3
JP2
D2
K
C6
C7
JP3
C4
As this pattern does not incorporate an over-current protection circuit or input fuse they must be added separately
if the circuit is to be used in practice.
◆Cautions for Mounting
Both flow and reflow is applicable when mounting.
The recommended temperature profile for reflow
soldering is shown below.
● Recommended Temperature Profile
240℃max
235±5℃
200℃
パ
ッ
ケ
150±10℃
ー
ジ
表
面
の
温
度
90±30s
10±1s
30±10s
時 間
Ensure that the following requirements are met
when using a soldering iron.
Tip temperature : 300℃ maximum
Soldering time : 5 sec. maximum
● Soldering Pad Reference Pattern
0.8
0.5
Unit : mm
19
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