STN1NF10 데이터 시트보기 (PDF) - STMicroelectronics
부품명
상세내역
제조사
STN1NF10 Datasheet PDF : 8 Pages
| |||
STN1NF10
THERMAL DATA
Rthj-pcb
Rthj-pcb
Tl
Thermal Resistance Junction-PCB(1 inch2 copper board)
Thermal Resistance Junction-PCB (min. footprint)
Maximum Lead Temperature For Soldering Purpose
50
°C/W
90
°C/W
260
°C
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
100
V
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20V
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
ID = 0.5 A
Min.
2
Typ.
3
0.7
Max.
4
0.8
Unit
V
Ω
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 1 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
1
105
20
9
Max.
Unit
S
pF
pF
pF
2/8
Share Link: 