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T0780-6C 데이터 시트보기 (PDF) - Atmel Corporation

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T0780-6C Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Figure 14. Demo Test Board (Fully Assembled PCB)
T0780 [Preliminary]
Figure 15. Recommended Package Footprint
In order to avoid soldering problems, plugging of the ground vias under the heat slug is recommended!
31.75
6.35
3.0
0.74
0.4
0.74
3.0
f0.33 via
0.7
0.9
6.9
all units are in mm
- Indicates metalization - vias connect pad to underlying ground plane
Remark: heatslug must be soldered to GND.
9
4525D–SIGE–10/03

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