TDA4800 데이터 시트보기 (PDF) - Philips Electronics

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TDA4800

Vertical deflection circuit for monitor applications

Philips Electronics 

Philips Semiconductors

Vertical deflection circuit for monitor

applications

MOUNTING INSTRUCTIONS FOR

13-LEAD DBS13P POWER

PACKAGE

The rise in temperature caused by

power dissipation in the circuit is

reduced by adding a heatsink with a

sufficiently low thermal resistance:

Rth(mb-h) + Rth(h-a) = Rth(mb-a)

(e.g. the heatsink of Fig.5). It is

possible to attach the package to the

heatsink by screws (Fig.6) or by a

compression spring (Fig.7). A layer of

silicon grease between the heatsink

and the mounting base optimizes

thermal contact.

86

18.5

10.5

27

3.5

27

3.5

Product specification

TDA4800

50

1.5

10

5

22.5

63.5

M2.5

(2x)

MHA585

Dimensions in mm.

Fig.5 Heatsink made of black-leaded Aluminium.

page

,, heatsink

,,,,,,,,,,,,,,,, PCboard

MHA586

Fig.6 Package and heatsink

attached by screws.

1997 Mar 27

handbook, halfpage

27

6

22

0.4

8.5

4.5

12

30°

MHA587

Dimensions in mm.

Fig.7 Compression spring for easily attaching the package to the

heatsink of Fig.5.

12

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