CXA2566M 데이터 시트보기 (PDF) - Sony Semiconductor
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CXA2566M Datasheet PDF : 12 Pages
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Package Outline
Unit: mm
16PIN SOP (PLASTIC)
+ 0.4
9.9 – 0.1
16
9
CXA2566M
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-16P-L01
SOP016-P-0300
0.24 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
– 12 –
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