STPS2H100U(1998) 데이터 시트보기 (PDF) - STMicroelectronics
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STPS2H100U Datasheet PDF : 6 Pages
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STPS2H100A/U
Fig. 9: Thermal resistance junction to ambient
versus copper surface under each lead
(Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB).
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead
(Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA).
Rth(j-a) (°C/W)
120
Rth(j-a) (°C/W)
140
100
120
80
100
80
60
60
40
40
20
20
S(Cu) (cm²)
S(Cu) (cm²)
0
0
0
1
2
3
4
5
0
1
2
3
4
5
Fig. 11: Forward voltage drop versus forward
current .
IFM(A)
1E+1
1E+0
1E-1
Tj=125°C
Maximum
values
Tj=125°C
Typical
values
Tj=25°C
Maximum
values
VFM(V)
1E-2
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
4/6
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