STPS2H100U 데이터 시트보기 (PDF) - STMicroelectronics
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STPS2H100U Datasheet PDF : 12 Pages
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STPS2H100
Characteristics
Figure 13. Forward voltage drop versus forward Figure 14. Forward voltage drop versus forward
current (low level)
current (high level)
2.0 IFM(A)
1.8
1.6
Tj=125°C
(Maximum values)
1.4
1.2
Tj=125°C
1.0
(Typical values)
0.8
Tj=25°C
0.6
(Maximum values)
0.4
0.2
VFM(V)
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
100 IFM(A)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
Figure 15. Thermal resistance junction to
Figure 16. Thermal resistance junction to
ambient versus copper surface under each lead ambient versus copper surface under each lead
(SMA)
(SMAflat)
Rth(j-a)(°C/W)
130
120
110
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
100
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
SMA
4.5 5.0
200 Rth(j-a)(°C/W)
180
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
160
140
120
100
SMAflat
80
60
40
20
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 17. Thermal resistance junction to
Figure 18. Thermal resistance junction to
ambient versus copper surface under each lead ambient versus copper surface under each lead
(SMB)
(SMBflat)
Rth(j-a)(°C/W)
110
100
Epoxy printed circuit board FR4,
SMB
Copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
110
100
90
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
80
70
60
50
SMBflat
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DocID6115 Rev 8
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