L6402MH10RI 데이터 시트보기 (PDF) - Advanced Micro Devices

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L6402MH10RI

128 Megabit (4 M x 32-Bit/8 M x 16-Bit) MirrorBit™ 3.0 Volt-only Uniform Sector Flash Memory with Versatile I/O™ Control

Advanced Micro Devices 

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4

MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . 4

Flash Memory Block diagram . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6

Special Package Handling Instructions .................................... 6

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

x16 Mode .................................................................................. 7

x32 Mode .................................................................................. 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9

Table 1. Device Bus Operations ....................................................... 9

VersatileIOTM (VIO) Control ........................................................ 9

Requirements for Reading Array Data ................................... 10

Page Mode Read ............................................................................10

Writing Commands/Command Sequences ............................ 10

Write Buffer .....................................................................................10

Accelerated Program Operation ......................................................10

Autoselect Functions .......................................................................10

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 11

Table 2. Sector Address Table........................................................ 12

Table 3. Autoselect Codes, (High Voltage Method) ....................... 15

Sector Group Protection and Unprotection ............................. 16

Table 4. Sector Group Protection/Unprotection Address Table ..... 16

Temporary Sector Group Unprotect ....................................... 17

Figure 1. Temporary Sector Group Unprotect Operation ................17

Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...18

SecSi (Secured Silicon) Sector Flash Memory Region .......... 19

Table 5. SecSi Sector Contents ...................................................... 19

Figure 3. SecSi Sector Protect Verify ..............................................20

Hardware Data Protection ...................................................... 20

Low VCC Write Inhibit .....................................................................20

Write Pulse “Glitch” Protection ........................................................20

Logical Inhibit ..................................................................................20

Power-Up Write Inhibit ....................................................................20

Common Flash Memory Interface (CFI) . . . . . . . 20

Table 6. CFI Query Identification String ..........................................21

Table 7. System Interface String..................................................... 21

Table 8. Device Geometry Definition ..............................................22

Table 9. Primary Vendor-Specific Extended Query ........................23

Command Definitions . . . . . . . . . . . . . . . . . . . . . 24

Reading Array Data ................................................................ 24

Reset Command ..................................................................... 24

Autoselect Command Sequence ............................................ 24

Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 25

Doubleword/Word Program Command Sequence ................. 25

Unlock Bypass Command Sequence ..............................................25

Write Buffer Programming ...............................................................25

Accelerated Program ......................................................................26

Figure 4. Write Buffer Programming Operation ...............................27

Figure 5. Program Operation ..........................................................28

Program Suspend/Program Resume Command Sequence ... 28

Figure 6. Program Suspend/Program Resume ...............................28

Chip Erase Command Sequence ........................................... 29

Sector Erase Command Sequence ........................................ 29

Erase Suspend/Erase Resume Commands ........................... 29

Figure 7. Erase Operation .............................................................. 30

Table 10. Command Definitions (x32 Mode, WORD# = VIH) ......... 31

Table 11. Command Definitions (x16 Mode, WORD# = VIL).......... 32

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 33

DQ7 and DQ5: Data# Polling .................................................. 33

Figure 8. Data# Polling Algorithm .................................................. 33

DQ6 and DQ14: Toggle Bits I ................................................. 34

Figure 9. Toggle Bit Algorithm ........................................................ 35

DQ2 and DQ10: Toggle Bits II ................................................ 35

Reading Toggle Bits DQ6 and DQ14/DQ2 and DQ10 ............ 35

DQ5 and DQ13: Exceeded Timing Limits ............................... 36

DQ3 and DQ11: Sector Erase Timer ...................................... 36

DQ1: Write-to-Buffer Abort ..................................................... 37

Table 12. Write Operation Status................................................... 37

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 38

Figure 10. Maximum Negative Overshoot Waveform ................... 38

Figure 11. Maximum Positive Overshoot Waveform ..................... 38

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 38

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Figure 12. Test Setup ..................................................................... 40

Table 13. Test Specifications ......................................................... 40

Key to Switching Waveforms. . . . . . . . . . . . . . . . 40

Figure 13. Input Waveforms and

Measurement Levels ...................................................................... 40

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 41

Read-Only Operations ........................................................... 41

Figure 14. Read Operation Timings ............................................... 41

Figure 15. Page Read Timings ...................................................... 42

Hardware Reset (RESET#) .................................................... 43

Figure 16. Reset Timings ............................................................... 43

Erase and Program Operations .............................................. 44

Figure 17. Program Operation Timings .......................................... 45

Figure 18. Accelerated Program Timing Diagram .......................... 45

Figure 19. Chip/Sector Erase Operation Timings .......................... 46

Figure 20. Data# Polling Timings (During Embedded Algorithms) . 47

Figure 21. Toggle Bit Timings (During Embedded Algorithms) ...... 48

Figure 22. DQ2 vs. DQ6 ................................................................. 48

Temporary Sector Unprotect .................................................. 49

Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 49

Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 50

Alternate CE# Controlled Erase and Program Operations ..... 51

Figure 25. Alternate CE# Controlled Write (Erase/Program)

Operation Timings .......................................................................... 52

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 52

Erase And Programming Performance. . . . . . . . 53

TSOP Pin and BGA Package Capacitance . . . . . 53

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

LSB080—80-Ball Fortified Ball Grid Array (Fortified BGA)

13 x 11 mm Package .............................................................. 54

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55

January 23, 2006

Am29LV6402M

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