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SMCJ 데이터 시트보기 (PDF) - STMicroelectronics

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SMCJ
ST-Microelectronics
STMicroelectronics ST-Microelectronics
SMCJ Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
SMCJ
3
Package information
Package information
Case: JEDEC DO-214AB molded plastic over planar junction
Terminals: solder plated, solderable per MIL-STD-750, Method 2026
Polarity: for unidirectional types the band indicates cathode
Flammability: epoxy is rated UL94V-0
RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4. SMC dimensions
E1
D
E
A1
C
A2
E2
L
b
Figure 13. Footprint dimensions mm
(inches)
dimensions
Ref.
Millimeters
Inches
Min.
A1 1.90
A2 0.05
b
2.90
c
0.15
E
7.75
E1 6.60
E2 4.40
D
5.55
L
0.75
Max.
2.45
0.20
3.2
0.41
8.15
7.15
4.70
6.25
1.60
Min.
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
Max.
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
Figure 14. Marking layout(1)
1.54
(0.061)
5.11
(0.201)
1.54
(0.061)
Cathode bar ( unidirectional devices only )
8.19
(0.322)
3.14
(0.124)
e
xxx
z y ww
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
1. Marking layout can vary according to assembly location.
Doc ID 5617 Rev 8
7/10

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