TDA8946AJ 데이터 시트보기 (PDF) - NXP Semiconductors.

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TDA8946AJ

2 x 15 W BTL audio amplifier with DC gain control

NXP Semiconductors. 

Philips Semiconductors

TDA8946AJ

2 x 15 W BTL audio amplifier with DC gain control

4Ω

OUT2 −

220 nF

ON

220

OUT2 +

4Ω

MODE

nF

10 µF

SVR

1

220 nF

4.7

nF

4.7

nF

1

OUT1 −

220 nF

OUT1 +

4Ω

220 nF

220 nF

100 nF

4Ω

IN2 +

IN2 −

IN1 −

IN1 +

GC

SGND

VCC

1000 µF

GND

MGW628

Fig 16. Printed-circuit board layout (single-sided); components view.

14.1.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage

ripple rejection. The respective capacitor location should be as close as possible to

the device and grounded to the power ground. Proper power supply decoupling also

prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor

with low ESR - typical 100 nF - has to be placed as close as possible to the device.

For suppressing lower frequency noise and ripple signals, a large electrolytic

capacitor - e.g. 1000 µF or greater - must be placed close to the device.

The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail

voltage. For good THD and noise performance a low ESR capacitor is recommended.

14.2 Thermal behaviour and heatsink calculation

The measured maximum thermal resistance of the IC package, Rth(j-mb) is 2.5 K/W.

A calculation for the heatsink can be made, with the following parameters:

Tamb = 50 °C

VCC = 18 V and RL = 8 Ω

Tj(max) = 150 °C

Rth(tot) is the total thermal resistance between the junction and the ambient

including the heatsink. In the heatsink calculations the value of Rth(mb-h) is ignored.

9397 750 09434

Product data

Rev. 01 — 01 March 2002

© Koninklijke Philips Electronics N.V. 2002. All rights reserved.

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