AU80610006225AASLBXC 데이터 시트보기 (PDF) - Intel

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Intel® Atom™ Processor D400 and D500 Series

Intel 

Introduction

Term

Storage Conditions

TAC

TDP

TOM

TTM

VCC

VSS

VCCGFX

V_SM

VLD

Description

A non-operational state. The processor may be installed in a platform,

in a tray, or loose. Processors may be sealed in packaging or exposed

to free air. Under these conditions, processor landings should not be

connected to any supply voltages, have any I/Os biased or receive any

clocks. Upon exposure to “free air” (i.e., unsealed packaging or a

device removed from packaging material) the processor must be

handled in accordance with moisture sensitivity labeling (MSL) as

indicated on the packaging material.

Thermal Averaging Constant

Thermal Design Power

Top of Memory

Time-To-Market

Processor core power supply

Processor ground

Graphics core power supply

DDR2 power rail

Variable Length Decoding

1.7

References

Material and concepts available in the following documents may be beneficial when

reading this document:

Table 1-1. References

Document

Intel® 64 and IA-32 Architectures Software Developer's Manuals

Volume 1: Basic Architecture

Volume 2A: Instruction Set Reference, A-M

Volume 2B: Instruction Set Reference, N-Z

Volume 3A: System Programming Guide

Volume 3B: System Programming Guide

Intel® Atom™ Processor D500 Specification Update

Intel® Atom™ Processor D400 Specification Update

Intel® Atom™ Processor D400 and D500 Series Thermal Mechanical Design

Guidelines

Intel® NM10 Express Chipset Datasheet

Intel® NM10 Express Chipset Specification Update

Document

Number

http://

www.intel.com/

products/processor/

manuals/index.htm

322862-002

322861-002

322856-002

322896-001

322897-001

Datasheet

13

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