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AU80610006225AASLBXC 데이터 시트보기 (PDF) - Intel

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AU80610006225AASLBXC Datasheet PDF : 80 Pages
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Functional Description
3.1.2.2
Note:
3.1.3
DDR3 (SO-DIMM Only)
The system memory controller supports the following DDR3 data transfer rates, SO-
DIMM modules and DRAM device technologies:
DDR3 data transfer rate of 800 MT/s
DDR3 SO-DIMM modules (unbuffered, non-ECC)
— Raw card A = 2 ranks of x16 SDRAMs (double sided)
— Raw card B = 1 rank of x8 SDRAM (double sided)
x16/x8 means that each SDRAM component has 16/8 data lines.
— DDR3 DRAM Device Technology:
Standard 1-Gb and 2-Gb technologies and addressing are supported for x16/x8
devices. There is no support for SO-DIMMs with different technologies or
capacities on opposite sides of the same SO-DIMM. If one side of a SO-DIMM is
populated, the other side is either identical or empty.
— Supported DDR3 SO-DIMM module configurations
Raw Card
DIMM
Type
Capacity
A
1 GB
A
2 GB
B
1 GB
B
2 GB
DRAM
Device
Tech.
1 Gb
2 Gb
1 Gb
2 Gb
DRAM
Organization
64 M x16
128 M x16
128 M x8
256 M x8
# of
DRAM
Devices
8
8
8
8
# of
Ranks
2
2
1
1
# of
Banks
8
8
8
8
Rules for Populating DIMM Slots
The frequency of system memory will be the lowest frequency of all DIMMs in the
system, as determined through the SPD registers on the DIMMs. Timing parameters
[CAS latency (or CL + AL for DDR2), tRAS, tRCD, tRP] must be programmed to match
within a channel.
In single channel mode, any DIMM slot within the channel may be populated in any
order. To take advantage of enhanced addressing, it is best to populate both DIMM slots
with identical DIMMs.
3.2
Graphics Processing Unit
This section details the integrated graphics engines (3D, 2D and video), 3D pipeline,
and the respective capabilities.
The CPU’s graphics processing unit (GPU) contains several types of components. The
major components in the GPU are the engines, planes, pipes and ports. The GPU has a
3D/2D instruction processing unit to control the 3D and 2D engines respectively. The
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