AN17820B 데이터 시트보기 (PDF) - Panasonic Corporation

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AN17820B

Dual channel BTL 7.5 W audio power amplifier with volume and standby control

Panasonic Corporation 

AN17820B

„ Usage Notes (continued)

14. The IC should be mounted onto a flat-surfaced heat-sink first, in a manner where little stress is applied, then solder the leads on

the IC to the board.

15. If the tightening torque of the heat-sink is too low, the heat resistance will become large. If it is too high, the physical device will

be distorted which might result in a failure. The tightening torque recommended is 78.5N.cm.

16. Fasten the heat-sink firmly on the chassis or board. Do not create a structure where the heat-sink is supported by the IC.

17. The protection circuit is for maintaining safety against an abnormal operation. Therefore, design the protection circuit such that it

/ should not operate during normal operation. Especially for the over-temperature protection circuit, if the area of safe operation or

the absolute maximum rating is momentarily exceeded by output pin to VCC short, or output pin to GND short (ground fault), the

e LSI might be damaged before the over-temperature protection circuit starts working.

c tage. 18. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins

n d s because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON

cle and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.

a e lifecy 19. Check the risk that is caused by the failure of external components.

n u duct 20. In the event of abnormal operation condition whereby the output terminals swing towards supply / ground, the destruction of the

ro speaker may result. As such, please ensure that the rating of the speaker is appropriate and made of non-flammable material.

te tin four P 21. In the event of abnormal condition whereby the output terminals are short-circuit to ground or VCC terminal, very high heat

ing type n. dissipation may occur resulting in heat transfer directly or indirectly to peripheral components. Please consider non-flammable

MaDMaiintenniansce/DicscontoinuednipnPlcallenuaedsdepesmmlavfanaoihsieilntnilttodtptefweo:dnd/nl/ialiwsaosncncwwcocoiwenennt.gttisiynneUpuumeeRedidLcottayynbpp.opeeuadtnlaasteosnticin.cfoo.rjmp/aetnio/ materials for the peripheral components or setup including the PCB.

SDB00167BEB

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