TR3A475M020C1800 데이터 시트보기 (PDF) - Vishay Semiconductors
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TR3A475M020C1800
Vishay Semiconductors
TR3A475M020C1800 Datasheet PDF : 29 Pages
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Typical Performance Characteristics
Vishay Sprague
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Surge voltage
Post application of surge voltage (as specified in
the table above) in series with a 33 resistor at
the rate of 30 s ON, 30 s OFF, for 1000 successive
test cycles at 85 °C.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
Life test at +85 °C 1000 h application of rated voltage at 85 °C.
MIL-STD-202, method 108
Capacitance change
Dissipation factor
Leakage current
Within -20 % / +10 % of initial value
Initial specified limit
Shall not exceed 125 % of initial limit
Life test at +125 °C 1000 h application 2/3 of rated voltage at 125 °C.
MIL-STD-202, method 108
Capacitance change
Dissipation factor
Leakage current
Within -20 % / +10 % of initial value
Initial specified limit
Shall not exceed 125 % of initial limit
Humidity tests
At 60 °C / 90 % RH 1000 h, biased
Capacitance change
Dissipation factor
Leakage current
Within -10 % / +20 % of initial value
Not to exceed 150 % of initial limit
Shall not exceed 200 % of initial limit
Thermal shock
MIL-STD-202, method 107, test condition A
(-55 °C / +85 °C, for 1000 cycles)
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION CONDITION
Terminal strength / Apply a pressure load of 17.7 N for 60 s horizontally
shear force test
to the center of capacitor side body.
Vibration
MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz, 20 g peak, 8 h, at rated voltage
Shock
(specified pulse)
MIL-STD-202, method 213, condition I,
100 g peak
Resistance to
soldering heat
Recommended reflow profiles temperatures and
durations are located within the Capacitor Series
Guides
MIL-STD-202, method 210, condition B
Solderability and
dissolution of
metallization
Flammability
MIL-STD-202, method 208, ANSI/J-STD-002, test
B (SnPb) and B1 (lead (Pb)-free). Dissolution of
metallization: method D.
Does not apply to gold terminations.
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.
POST TEST PERFORMANCE
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Electrical measurements are not applicable, since the same
parts are used for shock (specified pulse) test.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Within ± 10 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to capacitors
post-conditioning.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Revision: 07-Feb-2019
3
Document Number: 40192
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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