NCS2200(2014) 데이터 시트보기 (PDF) - ON Semiconductor

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NCS2200
(Rev.:2014)

Low Voltage Comparators

ON Semiconductor 

NCS2200, NCS2200A, NCV2200, NCS2202A

PACKAGE DIMENSIONS

DFN6, 2x2.2

SQL SUFFIX

CASE 488−03

ISSUE G

D

AB

2X

ÍÍÍ PIN ONE

ÍÍÍ REFERENCE

ÍÍÍÍÍÍ 0.10 C

TOP VIEW

2X

0.10 C

0.10 C

DETAIL B

A3

6X

0.08 C

A1

SIDE VIEW

E

A

C

SEATING

PLANE

0.10 C A B b1

0.05 C NOTE 3

1

e

3

DETAIL A

D2

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. TERMINAL b MAY HAVE MOLD COMPOUND

MATERIAL ALONG SIDE EDGE.

6. DETAILS A AND B SHOW OPTIONAL VIEWS

FOR END OF TERMINAL LEAD AT EDGE OF

PACKAGE AND SIDE EDGE OF PACKAGE.

MILLIMETERS

DIM MIN NOM MAX

A 0.80 0.90 1.00

A1 0.00 0.03 0.05

A3

0.20 REF

b 0.20 0.25 0.30

b1 0.30 0.35 0.40

D

2.00 BSC

D2 0.40 0.50 0.60

E

2.20 BSC

e

0.65 BSC

L 0.30 0.35 0.40

L1 0.00 0.05 0.10

SOLDERING FOOTPRINT*

0.50

0.020

0.65

0.025

0.40

0.016

6

6X L

4

b 5X

0.50

0.020

1.9

0.075

0.65

0.025

0.10 C A B

SCALE 10:1

BOTTOM VIEW

0.05 C NOTE 3

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

EDGE OF PACKAGE

EXPOSED Cu

L1

ÉÉÉÉ MOLD CMPD

A3

DETAIL A

Bottom View

(Optional)

A1

DETAIL B

Side View

(Optional)

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