NCS2200 데이터 시트보기 (PDF) - ON Semiconductor
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NCS2200
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NCS2200 Datasheet PDF : 20 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN6 2x2.2 mm
CASE 488−03
ISSUE G
DATE 06 FEB 2006
SCALE 4:1
D
AB
2X
PIN ONE
ÍÍÍ REFERENCE
ÍÍÍÍÍÍ 0.10 C
E
TOP VIEW
2X
0.10 C
0.10 C
6X
0.08 C
DETAIL B
A3
A
A1
SIDE VIEW
C
SEATING
PLANE
0.10 C A B b1
0.05 C NOTE 3
1
e
3
DETAIL A
D2
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE AND SIDE EDGE OF PACKAGE.
MILLIMETERS
DIM MIN NOM MAX
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3
0.20 REF
b 0.20 0.25 0.30
b1 0.30 0.35 0.40
D
2.00 BSC
D2 0.40 0.50 0.60
E
2.20 BSC
e
0.65 BSC
L 0.30 0.35 0.40
L1 0.00 0.05 0.10
GENERIC
MARKING DIAGRAM*
xxM
xx = Specific Device Code
M = Date Code
6
6X L
4
b 5X
0.10 C A B
*This information is generic. Please refer
to device data sheet for actual part
marking.
SOLDERING FOOTPRINT*
BOTTOM VIEW
0.05 C NOTE 3
0.50
0.020
0.65
L1
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
ÉÉÉÉ A3
0.40
0.016
0.025
DETAIL A
Bottom View
(Optional)
A1
DETAIL B
Side View
(Optional)
0.50
0.020
1.9
0.075
0.65
0.025
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON04199D
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DFN6 2 X 2.2 X 0.9 X 0.65P
PAGE 1 OF 1
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