NXP Semiconductors
BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
14. Abbreviations
Table 15. Abbreviations
Acronym
Description
CPE
Customer-Premises Equipment
ESD
ElectroStatic Discharge
HTOL
High Temperature Operating Life
IR
InfraRed
ISM
Industrial, Scientific and Medical
MMIC
Monolithic Microwave Integrated Circuit
MoCA
Multimedia over Coax Alliance
PCB
Printed-Circuit Board
RFID
Radio Frequency IDentification
TX
Transmit
WLAN
Wireless Local Area Network
15. Revision history
Table 16. Revision history
Document ID Release date
Data sheet status
Change notice
Supersedes
BGA7024 v.3 20140611
Product data sheet
-
BGA7024 v.2
Modifications: • Table 5 on page 3: Thermal simulation results have been replaced by IR measurements results.
BGA7024 v.2 20100830
Product data sheet
-
BGA7024 v.1
BGA7024
20100528
Product data sheet
-
-
BGA7024
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 11 June 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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