BGA7024 데이터 시트보기 (PDF) - NXP Semiconductors.
부품명
상세내역
제조사
BGA7024 Datasheet PDF : 24 Pages
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NXP Semiconductors
BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
18. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
General description . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 3
8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 3
9
Scattering parameters . . . . . . . . . . . . . . . . . . . . 4
10
Reliability information . . . . . . . . . . . . . . . . . . . . 5
11
Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 5
12
Application information. . . . . . . . . . . . . . . . . . . 6
12.1
920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . . 6
12.2
1930 MHz to 1990 MHz . . . . . . . . . . . . . . . . . . 8
12.3
2110 MHz to 2170 MHz . . . . . . . . . . . . . . . . . 11
12.4
2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 14
12.5
PCB stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17
Contact information. . . . . . . . . . . . . . . . . . . . . 22
18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 June 2014
Document identifier: BGA7024
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