MT6260 데이터 시트보기 (PDF) - MediaTek Inc

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MT6260

GSM/GPRS/EDGE-RX SOC Processor Technical Brief

MediaTek Inc 

2.3.2 Thermal Operating Specifications

Symbol

Description

Thermal resistance from device junction to package

case

Maximum package temperature

Maximum power dissipation

Value

48

65

1.28

Unit

C/W

Deg C

W

Notes

2.3.3 Lead-free Packaging

MT6260 is provided in a lead-free package and meets RoHS requirements

2.4

2.4.1

Ordering Information

Top Marking Definition

Figure 6. Mass production top marking of MT6260

Part number

MT6260A/BMB-PCU-H

Package

TFBGA

Description

8.6mm*9.6mm, 199-ball, 0.5 mm pitch package,

non-security version

Free Datasheet http://www.datasheet4u.com/

loginid=songconglin@hongyucom.com,time=2013-01-07 14:30:28,ip=61.235.102.147,doctitle=MT6260 GSM GPRS EDGE-RX SOC Processor Technical Brief v0.10 (draft).pdf,company=Hongyu_WCX

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