ITF86172SK8T 데이터 시트보기 (PDF) - Intersil
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ITF86172SK8T Datasheet PDF : 12 Pages
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Test Circuits and Waveforms
ITF86172SK8T
VGS
Ig(REF)
VDS
RL
DUT
-
VDD
+
Qgs
0
Qg(TH)
VGS= -1V
-VGS
VDD
0
Ig(REF)
Qgd
VDS
Qg(-5)
VGS= -5V
Qg(TOT)
VGS= -10V
FIGURE 16. GATE CHARGE TEST CIRCUIT
FIGURE 17. GATE CHARGE WAVEFORMS
0V
-VGS
VGS
RGS
RL
VDS
-
+
DUT
tON
td(ON)
tr
0
10%
VDS
90%
0
10%
50%
VGS
PULSE WIDTH
tOFF
td(OFF)
tf
10%
90%
50%
90%
FIGURE 18. SWITCHING TIME TEST CIRCUIT
Thermal Resistance vs. Mounting Pad Area
The maximum rated junction temperature, TJM, and the
thermal resistance of the heat dissipating path determines the
maximum allowable device power dissipation, PDM, in an
application. Therefore the application’s ambient temperature,
TA (oC), and thermal resistance RθJA (oC/W) must be reviewed
to ensure that TJM is never exceeded. Equation 1
mathematically represents the relationship and serves as the
basis for establishing the rating of the part.
PDM = (---T----J--Z-M--θ----J-–---A-T----A-----)
(EQ. 1)
In using surface mount devices such as the SO8 package,
the environment in which it is applied will have a significant
influence on the part’s current and maximum power
dissipation ratings. Precise determination of PDM is complex
and influenced by many factors:
6
FIGURE 19. SWITCHING TIME WAVEFORM
1. Mounting pad area onto which the device is attached and
whether there is copper on one side or both sides of the
board.
2. The number of copper layers and the thickness of the board.
3. The use of external heat sinks.
4. The use of thermal vias.
5. Air flow and board orientation.
6. For non steady state applications, the pulse width, the
duty cycle and the transient thermal response of the part,
the board and the environment they are in.
Intersil provides thermal information to assist the designer’s
preliminary application evaluation. Figure 20 defines the
RθJA for the device as a function of the top copper
(component side) area. This is for a horizontally positioned
FR-4 board with 1oz copper after 1000 seconds of steady
state power with no air flow. This graph provides the
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