AT88SA10HS-TH-T(2010) 데이터 시트보기 (PDF) - Atmel Corporation

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AT88SA10HS-TH-T
(Rev.:2010)

Atmel CryptoAuthentication Host Security Chip

Atmel Corporation 

Atmel AT88SA10HS Host Authentication Chip

7. Package Drawing

3TS1 – Shrink SOT

3

GND

E1

E

SDA

VCC

1

2

e1

Top View

CL

End View

SEATING

PLANE

b

e

D

Side View

A2 A

A1

Notes:

1. Dimension D does not include mold flash, protrusions or gate burrs.

Mold flash, protrusions or gate burrs shall not exceed 0.25mm per

end. Dimension E1 does not include interlead flash or protrusion.

Interlead flash or protrusion shall not exceed 0.25mm per side.

2. The package top may be smaller than the package bottom.

Dimensions D and E1 are determined at the outermost extremes of

the plastic body exclusive of mold flash, tie bar burrs, gate burrs and

interlead flash, but including any mismatch between the top and

bottom of the plastic body.

3. These dimensions apply to the flat section of the lead between 0.08

mm and 0.15mm from the lead tip.

This drawing is for general information only. Refer to JEDEC Drawing

TO-236, Variation AB for additional information.

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

A

A1

A2

D

E

E1

L1

e1

b

MIN

NOM

MAX

0.89

-

1.12

0.01

-

0.10

0.88

-

1.02

2.80 2.90 3.04

2.10

-

2.64

1.20 1.30 1.40

0.54 REF

1.90 BSC

0.30

-

0.50

NOTE

1,2

1,2

3

Package Drawing Contact:

R packagedrawings@atmel.com

TITLE

3TS1, 3-lead, 1.30mm Body, Plastic Thin

Shrink Small Outline Package (Shrink SOT)

12/11/09

GPC

TBG

DRAWING NO. REV.

3TS1

B

19

8595F–SMEM–8/10

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