AT88SA10HS-TSU-T(2010) 데이터 시트보기 (PDF) - Atmel Corporation
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AT88SA10HS-TSU-T Datasheet PDF : 23 Pages
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8A2 –TSSOP
43 21
Pin 1 indicator
this corner
E1
E
L1
56 78
Top View
A
b
e
A2
D
Side View
L
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX
D
2.90 3.00 3.10
E
6.40 BSC
E1
4.30 4.40 4.50
A
–
–
1.20
A2
0.80 1.00 1.05
b
0.19
–
0.30
e
0.65 BSC
L
0.45 0.60 0.75
L1
1.00 RE3
NOTE
2, 5
3, 5
4
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not
exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space
between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
12/11/09
TITLE
Package Drawing Contact: 8A2, 8-lead, 4.4mm Body, Plastic Thin
packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
GPC
TNR
DRAWING NO. REV.
8A2
D
20 Atmel AT88SA10HS Host Authentication Chip
8595F–SMEM–8/10
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