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SPN02N60C3(2004) 데이터 시트보기 (PDF) - Infineon Technologies

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SPN02N60C3
(Rev.:2004)
Infineon
Infineon Technologies Infineon
SPN02N60C3 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Rev. 2.1
SPN02N60C3
Maximum Ratings
Parameter
Drain Source voltage slope
VDS = 480 V, ID = 1.8 A, Tj = 125 °C
Symbol
dv/dt
Value
50
Unit
V/ns
Thermal Characteristics
Parameter
Thermal resistance, junction - soldering point
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
Soldering temperature,
1.6 mm (0.063 in.) from case for 10s
Symbol
RthJS
RthJA
Tsold
Values
Unit
min. typ. max.
-
30
- K/W
-
110
-
-
-
70
-
- 260 °C
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter
Symbol Conditions
Values
Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 600
-
-V
Drain-Source avalanche
breakdown voltage
V(BR)DS VGS=0V, ID=0.25A
-
700 -
Gate threshold voltage
VGS(th) ID=80µΑ, VGS=VDS 2.1
3
3.9
Zero gate voltage drain current IDSS
VDS=600V, VGS=0V,
µA
Tj=25°C,
-
0.5
1
Tj=150°C
-
-
50
Gate-source leakage current
IGSS
VGS=30V, VDS=0V
-
Drain-source on-state resistance RDS(on) VGS=10V, ID=1.1A,
Tj=25°C
-
Tj=150°C
-
- 100 nA
2.7
3
7.3
-
Gate input resistance
RG
f=1MHz, open Drain
-
9
-
Page 2
2004-03-01

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