NCV8702(2013) 데이터 시트보기 (PDF) - ON Semiconductor
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NCV8702
(Rev.:2013)
(Rev.:2013)
ON Semiconductor
NCV8702 Datasheet PDF : 20 Pages
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NCV8702
PACKAGE DIMENSIONS
XDFN6 1.5x1.5, 0.5P
CASE 711AE
ISSUE A
D
PIN ONE
ÍÍÍÍ REFERENCE
ÍÍÍÍÍÍÍÍ 2X
0.10 C
2X
0.10 C TOP VIEW
0.05 C
DETAIL B
A
L
B
L1
DETAIL A
ALTERNATE TERMINAL
E
CONSTRUCTIONS
A
A3
A1
ÉÉÉÉ EXPOSED Cu
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.10 AND 0.20mm FROM TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.35 0.45
A1 0.00 0.05
A3
0.13 REF
b 0.20 0.30
D
1.50 BSC
E
1.50 BSC
e
0.50 BSC
L 0.40 0.60
L1 --- 0.15
L2 0.50 0.70
0.05 C
SIDE VIEW
DETAIL A
1
L2
e
3
C
SEATING
PLANE
5X
L
RECOMMENDED
MOUNTING FOOTPRINT*
6X 0.35
5X
0.73
1.80
6
4
BOTTOM VIEW
6X b
0.10 C A B
0.05 C NOTE 3
0.83
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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