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LC05111C18MTTTG 데이터 시트보기 (PDF) - ON Semiconductor

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LC05111C18MTTTG Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
D
6 54
PIN ONE
REFERENCE
ÉÉÉÉÉÉ 2X 0.10 C
1 23
2X
0.10 C TOP VIEW
0.10 C
8X 0.05 C
NOTE 3
A3
SIDE VIEW
D3
4X L3
D2
1
3
WDFN6 2.6x4.0, 0.65P, Dual Flag
CASE 511BZ
ISSUE B
DATE 02 NOV 2016
AB
E1 E
A
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. PROFILE TOLERANCE APPLIES TO THE
EXPOSED PADS AS WELL AS THE LEADS.
MILLIMETERS
DIM MIN MAX
A
−−− 0.80
A3 0.10 0.25
b 0.25 0.40
b2 0.15 0.30
D
2.60 BSC
D2 2.075 2.375
D3 1.20 1.50
D4 0.40 0.70
E
4.00 BSC
E1
3.80 REF
E2 2.95 3.05
E3 2.25 2.55
e
0.65 BSC
L 0.12 0.32
L2 −−− 0.10
L3 −−− 0.55
GENERIC
MARKING DIAGRAM*
D4
4X L2
4X b2
XXXXX
XXXXX
AYWWG
G
w/o ejector pin
XXXXX
AYWWG
w/ ejector pin
E3
E2
6X L
6
e
4
6X b
0.10 M C A B
BOTTOM VIEW
0.05 M C
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbFree Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
RECOMMENDED
SOLDERING FOOTPRINT*
2.29
0.53
0.27
6X
0.40
2.50 4.20
DOCUMENT NUMBER:
DESCRIPTION:
98AON81958F
PACKAGE
OUTLINE
1
0.65
PITCH
6X
0.40
DIMENSION: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
WDFN6 2.6X4.0, 0.65P, DUAL FLAG
PAGE 1 OF 1
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