NCP4586 데이터 시트보기 (PDF) - ON Semiconductor

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NCP4586

150 mA, Low Noise, Low Dropout Regulator

ON Semiconductor 

NCP4586

APPLICATION INFORMATION

A typical application circuit for NCP4586 series is shown

in Figure 42.

VIN

C1

470n

NCP 4586 x

VIN VOUT

CE

GND

VOUT

C2

470n

version of IC. Active high or low versions are available;

please see the ordering information table. The Enable pin

has an internal pull down current source for versions H and

D. If the enable function is not needed connect the CE pin to

ground for version L or connect the CE pin to VIN for

versions H and D.

Output Discharger

The D version includes a transistor between VOUT and

GND that is used for faster discharging of the output

capacitor. This function is activated when the IC goes into

disable mode.

Figure 42. Typical Application Schematic

Input Decoupling Capacitor (C1)

A 470 nF ceramic input decoupling capacitor should be

connected as close as possible to the input and ground pin of

the NCP4586. Higher values and lower ESR improves line

transient response.

Output Decoupling Capacitor (C2)

A 470 nF or larger ceramic output decoupling capacitor is

sufficient to achieve stable operation of the IC. If a tantalum

capacitor is used, and its ESR is high, loop oscillation may

result. The capacitors should be connected as close as

possible to the output and ground pins. Larger values and

lower ESR improves dynamic parameters.

Enable Operation

The Enable pin CE or CE may be used for turning the

regulator on and off. Control polarity is dependent on

Thermal

As power across the IC increases, it might become

necessary to provide some thermal relief. The maximum

power dissipation supported by the device is dependent

upon board design and layout. Mounting pad configuration

on the PCB, the board material, and also the ambient

temperature affect the rate of temperature rise for the part.

That is to say, when the device has good thermal

conductivity through the PCB, the junction temperature will

be relatively low with high power dissipation applications.

PCB Layout

Make VIN and GND line sufficient. If their impedance is

high, noise pickup or unstable operation may result. Connect

capacitors C1 and C2 as close as possible to the IC, and make

wiring as short as possible.

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