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CXB1563Q 데이터 시트보기 (PDF) - Sony Semiconductor
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CXB1563Q
2R IC for Optical Fiber Communication Receiver
Sony Semiconductor
CXB1563Q Datasheet PDF : 16 Pages
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Package Outline
Unit: mm
24
25
32PIN QFP (PLASTIC)
9.0
±
0.2
+ 0.3
7.0 – 0.1
17
16
0.1
+ 0.35
1.5 – 0.15
A
Kokubu Ass'y
32
1
0.8
9
8
b
0.24 M
+ 0.15
b = 0.30 – 0.10
( 0.30)
+ 0.2
0.1 – 0.1
0˚ to 10˚
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-32P-L01
P-QFP32-7x7-0.8
DETAIL
A
: SOLDER
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42 / COPPER ALLOY
PACKAGE MASS
0.2g
24
25
32PIN QFP (PLASTIC)
9.0
±
0.2
+ 0.3
7.0
–
0.1
17
16
0.1
+ 0.35
1.5
–
0.15
A
32
1
0.8
9
8
b
0.24 M
+ 0.15
b = 0.30
–
0.10
( 0.30)
+ 0.2
0.1
–
0.1
0
˚
to 10
˚
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-32P-L01
P-QFP32-7x7-0.8
DETAIL
A
: SOLDER
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42 / COPPER ALLOY
PACKAGE MASS
0.2g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
42 ALLOY
Sn-Bi Bi:1-4wt%
5-18
µ
m
–
16
–
CXB1563Q
Sony Corporation
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