VFB1012D 데이터 시트보기 (PDF) - Vishay Semiconductors

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VFB1012D

Ultra High Precision Z-Foil BGA Surface Mount Voltage Divider with 0.1 ppm/°C TCR Tracking, 0.01 % Tolerance Match and Power Coefficient Tracking of 5 ppm at Rated Power

Vishay Semiconductors 

VFB1012D (Z-Foil)

Ultra High Precision Z-Foil BGA Surface Mount Voltage Divider Vishay Foil Resistors

with 0.1 ppm/°C TCR Tracking, 0.01 % Tolerance Match and

Power Coefficient Tracking of 5 ppm at Rated Power

CHIP CONFIGURATION

High Purity Alumina

Substrate

Resistive Bulk®

Metal Foil

Solder Ball

Protective

Coating

CHIP DIMENSIONS

ØD

RECOMMENDED SOLDER PAD DIMENSIONS

ØS

L

C2

X

C1

W

G

DIMENSIONS in inches (millimeters)

L

W

0.122 ± 0.005

(3.10 ± 0.13)

0.102 ± 0.005

(2.59 ± 0.13)

D

0.020 ± 0.002

(0.51 ± 0.05)

C1

0.055 ± 0.003

(1.40 ± 0.08)

C2

0.075 ± 0.003

(1.91 ± 0.08)

THICKNESS

(with balls)

0.032 ± 0.003

(0.81 ± 0.08)

RECOMMENDED SOLDER PAD DIMENSIONS in inches (millimeters)

X

G

0.075 (1.91)

0.055 (1.40)

S

0.022 (0.56)

Document Number: 63122

Revision: 18-Apr-07

For any questions, contact: foil@vishay.com

www.vishay.com

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