NX25F011A 데이터 시트보기 (PDF) - NexFlash -> Winbond Electronics

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NX25F011A

1M-BIT AND 4M-BIT SERIAL FLASH MEMORIES WITH 4-PIN SPI INTERFACE

NexFlash -> Winbond Electronics 

NX25F011A

NX25F041A

AC ELECTRICAL CHARACTERISTICS

Symbol

tCYC

tWH

tWL

tRI

tFI

tSU

tH

tV

tLEAD

tLAG

tWP

tXP

tHD

tCD

tCS

tRB

tDIS

tHO

Description

SCK Serial Clock Period (1)

SCK Serial Clock High or Low Time

SCK Serial Clock Rise or Fall Time (2)

Data Input Setup Time to SCLK

Data Input Hold Time from SCLK

Data Output Valid after SCLK (1,3)

CS Setup Time to Command

CS Delay Time after Command

Erase/Write Program Time

(see Write to Sector Command)

Transfer Program-Buffer/SRAM

(see Transfer PB/SRAM Command)

SCK Setup Time to HOLD

SCK Hold Time from HOLD

CS Deselect Time

READY / BUSY Valid Time

Data Output Disable Time

Data Output Hold Time

Vcc = 5.0V

Vcc = 3.0V

Vcc = 5.0V

Vcc = 3.0V

Vcc = 5.0V

Vcc = 3.0V

Vcc = 5.0V

Vcc = 3.0V

Vcc = 5.0V

Vcc = 3.0V

16 MHz

Min Typ Max

62 — —

26 — —

—— 7

40 — —

0 ——

— — 60

———

100 — —

———

100 — —

———

— 5 10

—5—

— — 100

———

10 — —

30 — —

160 — —

160 — —

— — 160

0 ——

8 MHz

Min Typ Max

Unit

125 — —

ns

57 — —

ns

— — 10

ns

100 — —

ns

0 ——

ns

— — 70

ns

— — 115

ns

150 — —

ns

300 — —

ns

150 — —

ns

300 — —

ns

— 5 10

ms

— 5 10

ms

— — 100

µs

— — 200

µs

20 — —

ns

50 — —

ns

200 — —

ns

200 — —

ns

— — 200

ns

0 ——

ns

Notes:

1. To achieve maximum clock performance, the read clock edge will need to be set for rising edge operation in the configuration

register (RCE=1).

2. Test points are 10% and 90% points for rise/fall times. All others timings are measured at 50% point.

3. With 50 pF (8 MHz) or 30 pF (16 MHz) load SO to GND.

22

NexFlash Technologies, Inc.

PRELIMINARY NXSF014B-0699

06/11/99

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