SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0751, Rev. -
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
*
Max. Reverse Current*
Max. Voltage Rate of
Change
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
VF1
VF2
IR1
IR2
dv/dt
Condition
@ 10 A, Pulse, TJ = 25 °C
@ 10 A, Pulse, TJ = 125 °C
@VR = rated VR
TJ = 25 °C
@VR = rated VR
TJ = 125 °C
-
MBR10100
MBRB10100
Green Products
Max.
0.85
0.70
1.0
6
10,000
Units
V
V
mA
mA
V/μs
Thermal-Mechanical Specifications:
Characteristics
Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal
Resistance Junction to Case
(per leg)
Maximum Thermal
Resistance, Case to
HeatSink
Approximate Weight
Case Style
Symbol
TJ
Tstg
RθJC
RθCS
wt
Condition
-
-
Specification
-55 to +150
-55 to +150
DC operation
2.0
Mounting surface, smooth and
greased
0.50
(only for TO-220)
-
2
TO-220AC/D2PAK
Units
°C
°C
°C/W
°C/W
g
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